Enable-IT 868 Datasheet Page 14

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Hardware design SP1ML
14/27 DocID026906 Rev 3
Figure 6. Soldering profile
Time maintained above:
– Temperature T
L
– Temperature T
L
217 °C
60-70 sec
Peak temperature (T
P
) 240 °C
Time within 5 °C of actual peak temperature (T
P
)10-20 sec
Ramp-down rate 6 °C/sec
Time from 25 °C to peak temperature 8 minutes max.
Table 8. Soldering profile (continued)
Profile feature Lead-free assembly
GSPG1409141835SMD
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